Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device...http://www.google.com.au/patents/US7608860?utm_source=gb-gplus-sharePatent US7608860 - Light emitting devices suitable for flip-chip bonding
