A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber,...http://www.google.com.au/patents/US6558477?utm_source=gb-gplus-sharePatent US6558477 - Removal of photoresist through the use of hot deionized water bath, water vapor and ozone gas
