An electronics package comprises an integrated circuit (IC) coupled to an IC substrate in a flip-chip ball grid array (FCBGA) configuration. The IC comprises a high density pattern of interconnect pads around its periphery for coupling to a corresponding pattern of bonding pads on the IC substrate. The...http://www.google.com.au/patents/US6664483?utm_source=gb-gplus-sharePatent US6664483 - Electronic package with high density interconnect and associated methods
