Metal leads are formed on a copper conductive layer by applying a first resist and a main resist over the first resist, and forming aligned openings in these resist. A bottom layer of cover metal such as gold is plated onto the copper conductive layer in these openings, followed by a principal metal...http://www.google.com.au/patents/US6248656?utm_source=gb-gplus-sharePatent US6248656 - Metal-jacketed lead manufacturing process using resist layers
