Methods are provided for processing a substrate for depositing an adhesion layer having a low dielectric constant between two low k dielectric layers. In one aspect, the invention provides a method for processing a substrate including depositing a barrier layer on the substrate, wherein the barrier layer...http://www.google.com.au/patents/US20040175929?utm_source=gb-gplus-sharePatent US20040175929 - Method of improving interlayer adhesion
