Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and...http://www.google.com.au/patents/US8019467?utm_source=gb-gplus-sharePatent US8019467 - Scheduling method for processing equipment
