A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can...http://www.google.com.au/patents/US4573067?utm_source=gb-gplus-sharePatent US4573067 - Method and means for improved heat removal in compact semiconductor integrated circuits
