A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die....http://www.google.com.au/patents/US4942139?utm_source=gb-gplus-sharePatent US4942139 - Method of fabricating a brazed glass pre-passivated chip rectifier
