The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes between chips....http://www.google.com.au/patents/US7294921?utm_source=gb-gplus-sharePatent US7294921 - System-on-a-chip with multi-layered metallized through-hole interconnection
