A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities....http://www.google.com.au/patents/US7253021?utm_source=gb-gplus-sharePatent US7253021 - Transfer molding apparatus and method for manufacturing semiconductor devices
