Failure analysis method includes performing fixed radiation of semiconductor chip (wafer) by photocurrent generation laser beam, scanning and radiating a region to be observed on semiconductor chip by heating laser beam, detecting, by a SQUID fluxmeter, current change generated in the semiconductor chip...http://www.google.com.au/patents/US7825673?utm_source=gb-gplus-sharePatent US7825673 - Failure analysis method and failure analysis apparatus
