In an IC card of the invention, an IC module (3) is adhered to a first concave (9) of a card base (1) by means of an adhesive (7) and a gap (8) is formed between the outside surface of the IC module (3) and the inside surface of the first concave (9), the gap being wider in the inside upper part and...http://www.google.com.au/patents/US5208450?utm_source=gb-gplus-sharePatent US5208450 - IC card and a method for the manufacture of the same
