Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion...http://www.google.com.au/patents/US7470454?utm_source=gb-gplus-sharePatent US7470454 - Non-thermal process for forming porous low dielectric constant films
