Interconnect circuitry is formed on a selected face of several separate layered electronic assemblies simultaneously. This circuitry interconnects the I/O leads on each assembly, and it is formed by the steps of: (a) placing a plurality of the assemblies in a fixture with spacers between each assembly;...http://www.google.com.au/patents/US4999311?utm_source=gb-gplus-sharePatent US4999311 - Method of fabricating interconnections to I/O leads on layered electronic assemblies
