A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least...http://www.google.com.au/patents/US6449831?utm_source=gb-gplus-sharePatent US6449831 - Process for making a heater chip module
