A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive...http://www.google.com.au/patents/US8153477?utm_source=gb-gplus-sharePatent US8153477 - Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
