In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad...http://www.google.com.au/patents/US4727649?utm_source=gb-gplus-sharePatent US4727649 - Method for producing an optical device
