The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode pads, filling the openings with a solder paste,...http://www.google.com.au/patents/US6518163?utm_source=gb-gplus-sharePatent US6518163 - Method for forming bumps, semiconductor device, and solder paste
