A wafer-level packaging process for MEMS applications, and a MEMS package produced thereby, in which a SOI wafer is bonded to a MEMS wafer and the electrical feed-throughs are made through the SOI wafer. The method includes providing a first substrate having the functional element thereon connected to...http://www.google.com.au/patents/US6660564?utm_source=gb-gplus-sharePatent US6660564 - Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby
