Disclosed is a method of manufacturing a high-yield solder bumped semiconductor wafer. The method comprises providing a non-solderable transfer substrate having a transfer surface for receipt of solder material; depositing solder material onto the transfer surface to form solder bumps in a predetermined...http://www.google.com.au/patents/US4898320?utm_source=gb-gplus-sharePatent US4898320 - Method of manufacturing a high-yield solder bumped semiconductor wafer
