Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping...http://www.google.com.au/patents/US5675474?utm_source=gb-gplus-sharePatent US5675474 - Highly heat-radiating ceramic package
