A multi-layered metal bond pad for a semiconductor die having a conductive metal layer and an overlying ruthenium electrode layer. The ruthenium electrode layer protects the conductive metal from oxidation due to ambient environmental conditions. An interconnect structure such as a wire bond or solder...http://www.google.com.au/patents/US6452271?utm_source=gb-gplus-sharePatent US6452271 - Interconnect component for a semiconductor die including a ruthenium layer and a method for its fabrication
