A method of manufacturing a semiconductor device involves mounting a semiconductor chip, formed on top with a main electrode and a subelectrode smaller in area than the main electrode, on a die pad of an external lead frame through a first bonding material, mounting an inner lead frame in which plural...http://www.google.com.au/patents/US6919644?utm_source=gb-gplus-sharePatent US6919644 - Semiconductor device manufacturing method and semiconductor device manufactured thereby
