Raised contacts included within a semiconductor chip are bonded to respective external leads through the use of a bonding tool. The raised contacts and/or the external leads are varied in a fashion depending on their locations on a semiconductor substrate so as to compensate for lack of uniformity of...http://www.google.com.au/patents/US4536786?utm_source=gb-gplus-sharePatent US4536786 - Lead electrode connection in a semiconductor device
