A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width,...http://www.google.com.au/patents/US7989940?utm_source=gb-gplus-sharePatent US7989940 - System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
