A method for testing leads of an integrated circuit package. The method includes a testing substrate with a plurality of conductive portions for use in connection with a test probe. The method further includes at least one compressible conductive bridge member for providing electrical contact between...http://www.google.com.au/patents/US5766978?utm_source=gb-gplus-sharePatent US5766978 - Process for testing an integrated circuit package using an integrated circuit package retainer 
