In a state where a wafer is held by a wafer holding section and a temperature controlled liquid is discharged to a rim area on a rear face of the wafer from flow channels, a developing solution is heaped on a front face of the wafer. Thereafter, the wafer is rotated for a predetermined period of time...http://www.google.com.au/patents/US6332723?utm_source=gb-gplus-sharePatent US6332723 - Substrate processing apparatus and method
