An improved multilevel interconnect structure is provided. The interconnect structure includes several levels of conductors, wherein conductors on one level are staggered with respect to conductors on another level. Accordingly, a space between conductors on one level is directly above or ...http://www.google.com.au/patents/US5854131?utm_source=gb-gplus-sharePatent US5854131 - Integrated circuit having horizontally and vertically offset interconnect lines 
