A method for manufacturing package structure integrated circuit chips having a heat spreader is disclosed. A wiring substrate is first provided. An integrated circuit chip, having a first surface and a second surface, is then electrically and mechanically connected to the wiring substrate via a first...http://www.google.com.au/patents/US6162659?utm_source=gb-gplus-sharePatent US6162659 - Method for manufacturing a package structure having a heat spreader for integrated circuit chips
