A method and an apparatus for cleaning semiconductor devices, in which water droplets are completely eliminated after the wafer is cleaned in the course of the semiconductor manufacturing process. In the method and apparatus, after the thin film is cleaned, a cut off valve cuts off the supply...http://www.google.com.au/patents/US5833760?utm_source=gb-gplus-sharePatent US5833760 - Apparatus and method for cleaning semiconductor devices without leaving water droplets 
