A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower openings of the through-holes by means of squeegees....http://www.google.com.au/patents/US5268194?utm_source=gb-gplus-sharePatent US5268194 - Method of packing filler into through-holes in a printed circuit board
