One or more integrated circuit chips each containing conductive pads on one surface, are embedded in a substrate such that the conductive pads are exposed and the one surface of each chip is substantially coplanar with a top surface of the substrate. Electrically conductive material is placed over the...http://www.google.com.au/patents/US20030057563?utm_source=gb-gplus-sharePatent US20030057563 - INTEGRATED PACKAGE AND METHODS FOR MAKING SAME
