A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a...http://www.google.com.au/patents/US7612446?utm_source=gb-gplus-sharePatent US7612446 - Structures to enhance cooling of computer memory modules
