A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially between the metallic body and the ceramic...http://www.google.com.au/patents/US7274570?utm_source=gb-gplus-sharePatent US7274570 - Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment
