An electronic interconnection apparatus can include a sacrificial substrate, which can include first trenches and second trenches formed in the sacrificial substrate. The first trenches can be disposed below a surface of the sacrificial substrate, and the second trenches can be disposed below the first...http://www.google.com.au/patents/US7601039?utm_source=gb-gplus-sharePatent US7601039 - Microelectronic contact structure and method of making same
