A composite material is provided, which has a low thermal expansivity, a high thermal conductivity, and a good plastic workability, which composite material may be applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller...http://www.google.com.au/patents/US6909185?utm_source=gb-gplus-sharePatent US6909185 - Composite material including copper and cuprous oxide and application thereof
