A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically...http://www.google.com.au/patents/US7029953?utm_source=gb-gplus-sharePatent US7029953 - Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device
