Two bodies such as an integrated circuit and a heat sink are maintained in a low stress and high thermal conductance abutment by pressure from capillary attraction. A surface of one of the bodies is provided with grooves preferably having reentrant surfaces. A surface of the other body is brought into...http://www.google.com.au/patents/US4567505?utm_source=gb-gplus-sharePatent US4567505 - Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
