A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration...http://www.google.com.au/patents/US6297560?utm_source=gb-gplus-sharePatent US6297560 - Semiconductor flip-chip assembly with pre-applied encapsulating layers
