A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can...http://www.google.com.au/patents/US6782613?utm_source=gb-gplus-sharePatent US6782613 - Method of making an interposer with contact structures
