An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a...http://www.google.com.au/patents/US6538312?utm_source=gb-gplus-sharePatent US6538312 - Multilayered microelectronic device package with an integral window
