Tile-based routing between a bump pad and an input/output (I/O) device for implementation on a flip-chip integrated circuit (IC) die. A trace is routed between the bump pad and a position corresponding to a first I/O slot, the first I/O slot being at least partially occupied by the I/O device. A position...http://www.google.com.au/patents/US6225143?utm_source=gb-gplus-sharePatent US6225143 - Flip-chip integrated circuit routing to I/O devices
