A thin semiconductor device comprises a die pad (52) having a first thickness, a semiconductor chip (51) mounted on the die pad (52), a plurality of conductive leads (54) each having at least a portion having a second thickness greater than the first thickness, and conductors (53) interconnecting the...http://www.google.com.au/patents/US5157475?utm_source=gb-gplus-sharePatent US5157475 - Semiconductor device having a particular conductive lead structure
