The present invention provides a method and apparatus for forming reliable interconnects in which the overlap of the line over the plug or via is minimized or eliminated. In one aspect, a barrier plug comprised of a conductive material, such as tungsten, is deposited over the via to provide an etch stop...http://www.google.com.au/patents/US6372633?utm_source=gb-gplus-sharePatent US6372633 - Method and apparatus for forming metal interconnects
