An improved structure of a heat sink for power semiconductors is provided in the form of a U-shaped heat sink extruded from an aluminum material. The heat sink has a number of individual and oppositely juxtaposed heat dissipation fins formed along the inside and the outside surfaces of the two lateral...http://www.google.com.au/patents/US5587608?utm_source=gb-gplus-sharePatent US5587608 - Structure heat sink for power semiconductors
