Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier...http://www.google.com.au/patents/US6777817?utm_source=gb-gplus-sharePatent US6777817 - Reworkable and thermally conductive adhesive and use thereof
