A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart...http://www.google.com.au/patents/US6176966?utm_source=gb-gplus-sharePatent US6176966 - Method of die bonding electronic component and die bonding apparatus thereof
