The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a...http://www.google.com.au/patents/US7675145?utm_source=gb-gplus-sharePatent US7675145 - Apparatus, system and method for use in mounting electronic elements
