The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried...http://www.google.com.au/patents/US6205654?utm_source=gb-gplus-sharePatent US6205654 - Method of manufacturing a surface mount package
