This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction...http://www.google.com.au/patents/US6674140?utm_source=gb-gplus-sharePatent US6674140 - Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
